Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Analyzing a Printed Circuit Board with Oxide Residue
A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing
.. read more
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
The Effect of Functional Pads and Pitch on Via Reliability using Thermal Cycling and Interconnect Stress Testing
European legislation has meant that lead-free solders now dominate mainstream electronics manufacturing. These
replacement solders are all high tin alloys with significantly higher melting poin
.. read more
Analyzing a Printed Circuit Board with Oxide Residue
A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing
.. read more
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. The issue was n
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
The Effect of Functional Pads and Pitch on Via Reliability using Thermal Cycling and Interconnect Stress Testing
European legislation has meant that lead-free solders now dominate mainstream electronics manufacturing. These
replacement solders are all high tin alloys with significantly higher melting poin
.. read more