Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Effects of Nano-Tio2 Particles Additions on Microstructure Development And Hardness of Sn3.5Ag0.5Cu Composite Solder
The effects of nano-TiO particle additives on the microstructure and microhardness of the 2 Sn3.5Ag0.5Cu composite solder were studied. Results show that alloying with nano-TiO 2 particles dram
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. read more
Influence of Microstructure on Mechanical Behavior of Bi-Containing Pb-Free Solders
SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Choosing a Low-Cost Alternative to Sac Alloys for PCB Assembly
Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Improving Tin Whisker Testing through Quantitative Measurements of Plated Film Properties
- Correlating film properties to the propensity to whisker will lead to the development of a comprehensive whisker growth model and create successful mitigation strategies.
•Hillock and whisker
.. read more
Effects of Nano-Tio2 Particles Additions on Microstructure Development And Hardness of Sn3.5Ag0.5Cu Composite Solder
The effects of nano-TiO particle additives on the microstructure and microhardness of the 2 Sn3.5Ag0.5Cu composite solder were studied. Results show that alloying with nano-TiO 2 particles dram
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Optimizing the Automated Assembly Process for Filled-Polymer Based Thermal Bondlines
Great efforts are expended by researchers to develop new and better thermal interface materials. In contrast,optimization of the performance of a given material is usually left to more empirica
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
The New Lead Free Assembly Rework Solution Using Low Melting Alloys
This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Accelerated Reliability Testing and Analysis of Lead Free Solder Interconnects
The Pb-free solder interconnect reliability performance of a wide variety of common SMT component types was measured in
an IPC-9701 TC1 thermal cycle (0-100°C / 40 min cycle). Seventeen differe
.. read more