Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A View from the Top: Succeeding as Women Engineers in Microelectronics
On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and D
.. read more
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more
A View from the Top: Succeeding as Women Engineers in Microelectronics
On August 14, 2024, IPC hosted an inspiring webinar celebrating the accomplishments of two outstanding women in the electronics industry—Cheah Soo Lan, Master IPC Trainer for CID/CID+, and D
.. read more
Microvia Reliability Failure Modes
Recent increases in assembly temperatures in response to removing lead from solder used in printed circuit boards (PCBs)
assembly has increase the strain and stress on interconnect structures.
.. read more
BGA Breakout Challenges
The routing of large pin-count and dense BGAs has a significant impact on the cost of the PCB,primarily in terms of layer count and via technology. This paper is the result of considerable rese
.. read more
Introduction to Microvia Design
Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and
conditions that designers needs to consider to introduce microvias t
.. read more
Effect of Lead-Free Alloys on Voiding at Microvia
For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with
95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre
.. read more