Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Thermal Stress Reliability of Stacked Microvias Fabricated with a Liquid Metal Ink Semi-Additive Process
Latent reliability issues with stacked filled microvia designs for complex printed circuit boards fabricated using subtractive-etch processes have been well-documented in recent years. This
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
IPC/IMEC/ESA Microvia TV IST Test Results
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failu
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
Influence of Plating Quality on Reliability of Microvias
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi
.. read more
Effects of Dielectric Material,Aspect Ratio and Copper Plating on Microvia Reliability
This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp
.. read more
Microvia Reliability Concerns in the Lead Free Assembly Environment
Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). With the advent of lead free assembly the vulnerability of high
.. read more