Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and
.. read more
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
ULTRA HDI Printed Boards
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu
.. read more
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. read more
Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...)...
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
.. read more
Overview Miniaturization on Large Form factor PCBA
The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall
.. read more
Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
.. read more
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. read more
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. read more
Stencil Printing Process Tools for Miniaturisation and High Yield Processing
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic
products,with increased functionality and smaller form factor,the boundari
.. read more
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. read more
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. read more
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
How to Achieve 40 Microns (1.6 Mil) Placement Spacing with E01005/M0402
When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations.
Hawse
.. read more
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
.. read more
Overcoming the Complexity of Flex and Rigid Flex Design
Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as
cabling harness technology,IC packaging and as replacement for rigid board
.. read more
The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
.. read more
Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
20μm Prepreg Substrates for Ultra-Thin Insulated Single-Layer
Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit
density design,requiring thinner insulation layers,smaller via holes a
.. read more
The European Roadmap
A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a
foreseeable future time. However,the EIPC has worked together with
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
A Fully Additive Approach for High-Density Interconnect Printed Circuit Boards
High-density interconnect printed circuit boards (HDI PCBs) technology is evolving to enable further miniaturization and functionality of electronics like smartphones, tablet computers, and
.. read more
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Realization of a New Concept for Power Chip Embedding
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top
.. read more
ULTRA HDI Printed Boards
This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu
.. read more
Thermally Conductive Polymeric Material (TCPM)
The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro
.. read more
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various
.. read more
Ultra-Low Voiding Halogen-Free No-Clean Lead-Free Solder Paste for Large Pads
The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr
.. read more
Tiny With a Big Impact: True of False? Impact of the Component Complexity on the assembly process. Miniaturized Components (01005,03015...)...
The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi
.. read more
Overview Miniaturization on Large Form factor PCBA
The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall
.. read more
Device Miniaturization - The Impact of a High Density SoC Direct Chip Attach on Surface Mount and PCB Technologies
To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si
.. read more
Beyond 0402M Placement: Process Considerations for 03015M Microchip Mounting
The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s
.. read more
Miniaturization with Help of Reduced Component to Component Spacing
Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are
.. read more
Challenges of Manufacturing with Printed Circuit Board Cavities
Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa
.. read more
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
.. read more
Stencil Printing Process Tools for Miniaturisation and High Yield Processing
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic
products,with increased functionality and smaller form factor,the boundari
.. read more
Validity of the IPC R.O.S.E. Method 2.3.25 Researched
Miniaturization and higher functionality in electronics packaging require the use of advanced packages and small components. This trend has translated into the use of new package types such as
.. read more
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. read more
Embedded Packaging Technologies: Imbedding Components to Meet Form,Fit,and Function
As the electronics industry moves toward smaller form and fit factors,advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are no
.. read more
A Study of 0201’s and Tombstoning in Lead-Free Systems,Phase II Comparison of Final Finishes and Solder Paste Formulations
Tombstoning,the phenomena where a chip component stands up on one end during the reflow cycle,is well-documented and understood in tin-lead systems. It is reported to occur more frequently in l
.. read more
How to Achieve 40 Microns (1.6 Mil) Placement Spacing with E01005/M0402
When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations.
Hawse
.. read more
S0201 Process and Yield Improvement During Launch to Production
Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process
parameters emerge and old process parameters become significantly m
.. read more
Overcoming the Complexity of Flex and Rigid Flex Design
Flexible printed circuits are a growing technology both in terms of numbers and in technology advancement. Applied as
cabling harness technology,IC packaging and as replacement for rigid board
.. read more
The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
.. read more
Embedding Passive and Active Components in PCB - Solution For Miniaturization
The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component
placement. The embedding of the passive components inside the PCB has already
.. read more
Removal of Palladium Residue in Semi-Additive Process for Enhanced Reliability in
In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making
rapid progresses for even circuit features on printed wiring boards
.. read more
20μm Prepreg Substrates for Ultra-Thin Insulated Single-Layer
Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit
density design,requiring thinner insulation layers,smaller via holes a
.. read more
The European Roadmap
A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a
foreseeable future time. However,the EIPC has worked together with
.. read more