Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang
.. read more
Double Reflow-Induced Interfacial Failures in Pb-free Ball Grid Array Solder Joints
Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu
.. read more
Warpage Issues and Assembly Challenges Using Coreless Package Substrate
Coreless technology in package substrate has been developed to satisfy the increasing demand of lighter,smaller and superior electrical performance regarding as the future trend in electronic a
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages
There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices,the emergence of lead-free processing,and chang
.. read more