Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
.. read more
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more
Protecting Automotive Electronics with Vacuum-Deposited Parylene Increasing Electronic Longevity in the Global Automotive Industry
Over the years,electronic components have become
increasingly smaller and integrated. Spacing between
components and line to line spacing has continually
shrunk. This miniaturization has magnif
.. read more
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi
.. read more
Design for Reliability: Improving Reliability of Plastic Encapsulated Ocean Technology Products by Understanding Moisture Ingress through FEA Simulation
Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da
.. read more
Performance of Photoimageable Solder Masks – A Study on Thermal Stress
The continuous temperature resistance of electrically insulating materials can be judged by examining the effect of thermal stress loads on the electrical properties,such as moisture and insula
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Capabilities of Tools Used to Measure Voids to Industry Standards
It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and
specifically BGAs. There have been many publications which discuss this phenomena,
.. read more
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more
Protecting Automotive Electronics with Vacuum-Deposited Parylene Increasing Electronic Longevity in the Global Automotive Industry
Over the years,electronic components have become
increasingly smaller and integrated. Spacing between
components and line to line spacing has continually
shrunk. This miniaturization has magnif
.. read more