Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. read more
Thermoplastic Injection Molding: New Packages and 3D Circuits
Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed
circuit boards,but this may change with increasing technical,economic and re
.. read more
Gold Stud Bump Flip Chip Bonding on Molded Interconnect Devices
A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th
.. read more
Thermoplastic Injection Molding: New Packages and 3D Circuits
Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed
circuit boards,but this may change with increasing technical,economic and re
.. read more