Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice
As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage,
.. read more
Next Progression in Microvia Reliability Validation – Reflow Simulation of a PCB Design Attributes and Material Structural Properties During the...
As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more