Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Analysis of a Dynamic Flexed Flat Cable Harness
A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the t
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more
Analysis of a Dynamic Flexed Flat Cable Harness
A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. The purpose of the t
.. read more
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but
.. read more
Microvia Process Guidelines
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circ
.. read more
Experience in Processing EEE Components with Pure Electroplated Tin Leads As a
The regulatory measures defined in MIL performance standards that govern production of active and passive electronic components ban the application of pure Sn plated leads for EEE parts. The st
.. read more