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Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more
Contributing Factors to the Reliability of Buried Vias in High-Density Interconnect PCBs
In recent years, most research on high-density interconnect (HDI) PCBs focused on microvias. Based on previous test results in the frame of the ongoing research project on HDI PCBs for space
.. read more
A DOE to assess PCB fabrication material design and process using IST (Interconnect Stress Testing) to improve fine pitch BGA...
During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer
.. read more