Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Does the Presence of Components Make a Difference? A New SIR Test Protocol to Characterize a Lead-Free,Electronic Production Process
Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials,
particularly solder fluxes. Existing Surface Insulation resistance (SIR) test methods
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Does the Presence of Components Make a Difference? A New SIR Test Protocol to Characterize a Lead-Free,Electronic Production Process
Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials,
particularly solder fluxes. Existing Surface Insulation resistance (SIR) test methods
.. read more