Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
.. read more
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. read more
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Low Silver Solder Alloys with Good Drop Shock and Thermal Cycle Reliability
SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements
.. read more
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. read more
A Compliant and Creep Resistant SAC-Al (Ni) Alloy
Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct
.. read more
Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
.. read more
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead Free Solder
One of the factors that has contributed to the establishment of the Ni-modified Sn-Cu eutectic as one of the major alternatives
to the widely promoted Sn-Ag-Cu alloys as an RoHS compliant lead-
.. read more
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder
While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed
circuit board assembly the effect of Ni is not yet fully understood
.. read more
Erosion of Copper and Stainless Steels by Lead-Free-Solders
An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave
soldering is the erosion of the copper of printed circuit board patter
.. read more
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more