Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. read more
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. read more
High Phosphorus ENIG – Highest Resistance Against Corrosive Environment
Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a
final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a
.. read more
High Phosphorous Electroless Nickel Process for Mobile Phone PWBs
An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is
currently a mainstream final finishing application for mobile phone Printed Wir
.. read more
Phosphorus in Electroless Nickel Layers – Curse or Blessing?
The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the
reliability of the solder joint integrity was investigated. The solder joint
.. read more
High Phosphorus ENIG – Highest Resistance Against Corrosive Environment
Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a
final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a
.. read more