Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. read more
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. read more
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. read more
High Phosphorus Electroless Nickel for Selective ENIG (SENIG)
Concerns
There are some areas that must be accepted if planning to run the newest SENIG process:
- Slower plating rate in nickel (to get 150µ“ it will take 20 minutes)
- It works better at hig
.. read more