Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. read more
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. read more
Single Ball Reballing and Repair of BGA Components
The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the
development of smaller and smaller components and the continued difficulty o
.. read more
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Board Finish Solderability with Sn-Ag-Cu
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the
industry. It is expected that soldering in a nitrogen atmosphere might over
.. read more
Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes
The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based
corporations to investigate lead-free (Pb-free) surface mount soldering technology. The
.. read more
Study of Assembly Processes for Solder Flip Chips on FR-4 Substrates
Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip
interconnection types including anisotropic conductive film or
.. read more