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Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
Flux Collection and Self-Clean Technique in Reflow Applications
The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part II
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the
predominance of consumer-type electronics. The continuing trend of increasing
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Cleanliness Comparison – C3 Localized Versus Total Board Extractions
In this evaluation we will show an ionic residue comparison using Umpire 2 boards that were top and bottom surface mounted with standard reflow and selective wave soldered on the connector and
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Case Study Comparing the Solderability of a Specific Pb Free No Clean Paste in Vapor Phase and Convection Reflow
To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as
.. read more
Flux Collection and Self-Clean Technique in Reflow Applications
The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
Determining the Reliability of Tacky Fluxes in Varying Soldering Applications
The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th
.. read more
Development of Lead Free Paste for Small Reflow Ovens
Today,there exists a major push towards lead free soldering in the international electronics industry. It has presented a
number of challenges in both the surface mount and wave soldering proce
.. read more
Lead-Free Soldering: DOE Study to Understand its Affect on Electronic Assembly Defluxing
Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly
cleaning processes. The purpose of this study is to evaluate how th
.. read more
Lead Free Process Transition Solder Paste Characteristic Assessment
The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original
draft of the legislation. A true Pb-free solution for product such
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more