Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more
CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to
.. read more
Effect of BGA Reballing and its Influence on Ball Shear Strength
As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre
.. read more
Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
.. read more
The Effects of Partially Activated No-Clean Flux Residues under Component Bodies and No-Clean Flux Residues Entrapped Under RF Cans on...
With the predominance of no-clean soldering processes and ever decreasing component standoff,the industry has had to consider the reliability of,what may be,partially activated or “gooey” flux
.. read more
3 Steps to Successful Solder Paste Selection
Choosing a solder paste can make or break an assembly process. By choosing the right solder paste for the application,you will achieve the highest process consistency and solder joint quality.
.. read more