Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost...
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
.. read more
Overcoming Logistic,Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification
With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture.
With BGA components sometimes costing hundreds or even thousands of US
.. read more
Are Scandinavian Companies Ready for Production of Lead Free PCBs?
For more than two years,experts,authorities and sales people in the electronic industry have talked about WEEE and
RoHS. In most cases,it has been theoretical and few companies in Scandinavia h
.. read more
Lead Free Implementation in the Global Market
The Restriction of Hazardous Substances (RoHS) directive is requires companies to change the way they design,
manufacture,track,and bring new products into the market. In order to provide the n
.. read more
OEM/EMS NPI Collaboration: Optimizing the Design and NPI Supply Chain to Improve Time-To-Volume Manufacturing
The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core
competencies that enhance shareholder value. This outsourcing trend i
.. read more
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. read more
The 2002 - 2003 National Technology Roadmap for Electronic Interconnections
The OEM desires identified in the 2002 – 2003
roadmap clearly identify,through their emulators,the
present and future needs of the products that the
emulators represent. There are a total of ei
.. read more
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man
.. read more
Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is to Deliver Optimum Balance Between Landed Cost...
The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo
.. read more
Overcoming Logistic,Economic and Technical Challenges to Implementing Functional Test in High Mix / High Volume Production Environments
Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar
.. read more
Lead Free Assembly Qualification of Stacked MicroVia Boards
Beginning July 2006,the electronic industry will enter the age of lead –free assembly and products in Europe. The removal
of lead from electronics brings massive changes for all companies in th
.. read more
X-ray Inspection of Voids in BGA Joints with Respect to the IPC-7095A Specification
With the introduction of Lead-free solder,voiding within BGA joints is potentially a major issue during PCBA manufacture.
With BGA components sometimes costing hundreds or even thousands of US
.. read more
Are Scandinavian Companies Ready for Production of Lead Free PCBs?
For more than two years,experts,authorities and sales people in the electronic industry have talked about WEEE and
RoHS. In most cases,it has been theoretical and few companies in Scandinavia h
.. read more
Lead Free Implementation in the Global Market
The Restriction of Hazardous Substances (RoHS) directive is requires companies to change the way they design,
manufacture,track,and bring new products into the market. In order to provide the n
.. read more
OEM/EMS NPI Collaboration: Optimizing the Design and NPI Supply Chain to Improve Time-To-Volume Manufacturing
The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core
competencies that enhance shareholder value. This outsourcing trend i
.. read more
EMS/OEM Interaction: Maximizing Benefit by Optimizing Communication
The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the
increase in outsourcing of manufacturing services. This has resulted in the conseq
.. read more
The 2002 - 2003 National Technology Roadmap for Electronic Interconnections
The OEM desires identified in the 2002 – 2003
roadmap clearly identify,through their emulators,the
present and future needs of the products that the
emulators represent. There are a total of ei
.. read more
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man
.. read more