Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
.. read more
PWB Stress Testing Correlation: Accelerated vs. Application – “The Round Robin Begins”
Round Robin Reliability Evaluation “Revival” Proposal
1.TR-579
2.IST( IPC-9151/TM 2.6.26) 3.HATS (IPC-9151)
4.CITC(EIT) 5.TS(TM650-2.6.7.2B,MIL31032/1C) 6. Application(Odometer )
.. read more
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
.. read more
Low Surface Energy Coatings,Rewrites the Area Ratio Rules
Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en
.. read more
PWB Stress Testing Correlation: Accelerated vs. Application – “The Round Robin Begins”
Round Robin Reliability Evaluation “Revival” Proposal
1.TR-579
2.IST( IPC-9151/TM 2.6.26) 3.HATS (IPC-9151)
4.CITC(EIT) 5.TS(TM650-2.6.7.2B,MIL31032/1C) 6. Application(Odometer )
.. read more
SELECTION OF WAVE SOLDERING FLUXES FOR LEAD-FREE ASSEMBLY
The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl
.. read more
Design and Development of a High Performance Wirebond BGA Package
As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities
exist to support these applications with higher performance wire bonded pa
.. read more