Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
Behind Closed Doors – What You Don’t Know About Your CVD Chamber
Purpose
One of the challenges of larger parylene chemical vapor deposition (CVD) chambers is what seems to be unpredictable material behavior throughout the working volume. The tig
.. read more
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
State of the Art Detection and Analysis of Outgassed compounds for the Optoelectronics and Micro Assembly Industries
The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and
construct optoelectronic packages,sub-assemblies,and other electronic materials is b
.. read more
Outgassing Behaviour of SMT Flux Residue During Reflow Soldering
SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can
.. read more
How to Manage Material Outgassing in Reflow Oven
In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa
.. read more
Behind Closed Doors – What You Don’t Know About Your CVD Chamber
Purpose
One of the challenges of larger parylene chemical vapor deposition (CVD) chambers is what seems to be unpredictable material behavior throughout the working volume. The tig
.. read more
Silicone Migration Concerns in Thermal Materials – How Real are They?
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typical
.. read more
An Investigation into the Predictability of PCB Coplanarity for Room vs. Lead Free Assembly Temperatures
With the advent of larger packages and higher densities/pitch the Industry has been concerned with the co -planarity of both
the substrate package and the PCB motherboard. The iNEMI PCB Co-Plan
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
State of the Art Detection and Analysis of Outgassed compounds for the Optoelectronics and Micro Assembly Industries
The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and
construct optoelectronic packages,sub-assemblies,and other electronic materials is b
.. read more