Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
.. read more
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Broadband Printing: The New SMT Challenge
The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People
.. read more
Stencil Design and Performance for Flip Chip/Wafer Bumping
There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted
using a stencil aperture that is larger than the wafer pad. This perm
.. read more
Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
.. read more