Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Lead-Free Nanosolder Based Nanomaterials Assembly and Integration
Nanomaterials have shown great promise in various applications including nanoelectronics and devices. However,in order to achieve large-scale nanoelectronics assembly and manufacturing,the deve
.. read more
Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging
- Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method;
- Flux assisted environment enhanced reflow result and micron scale solder spheroids forme
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. read more
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. read more
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. read more
Study Of Performance of Liquid Metal Containing Different Contents of Ag Particular Additives for Thermal Interface Materials
In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5
.. read more
Lead-Free Nanosolder Based Nanomaterials Assembly and Integration
Nanomaterials have shown great promise in various applications including nanoelectronics and devices. However,in order to achieve large-scale nanoelectronics assembly and manufacturing,the deve
.. read more
Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging
- Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method;
- Flux assisted environment enhanced reflow result and micron scale solder spheroids forme
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Improving Joint Quality with Nitrogen
Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes
available claim that they either do not need nitrogen or work equally well
.. read more
Oxidation and Topography of Powder in Pb-free Solder Paste
There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these
include the following:
?? Customer requirements to reflow SAC-based (SnAgCu)
.. read more
Next Generation Organic Solderability Preservatives (OSP) for Lead-free soldering and Mixed Metal Finish PWB’s and BGA Substrates
With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly
becoming more critical,fabricators and OEM’s must determine the mo
.. read more