Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. read more
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. read more
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. read more
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. read more
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more