Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

Filters
Filters
Reset Filters
Display

Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres

Board-level drop test performance was evaluated and compared for the following four different solder combinations in BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti .. read more

Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield

With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT. .. read more

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo .. read more

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo .. read more

Board Level Interconnect Reliability Assessment of High I/O BGA Packages

To meet the complex design requirements of the electronics industry,there is an increased need for large size high I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+ .. read more

Drop Test Performance of Bga Assembly Using Sac105ti Solder Spheres

Board-level drop test performance was evaluated and compared for the following four different solder combinations in BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti .. read more

Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield

With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT. .. read more

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo .. read more

Solder Joint Reliability of Pb-free Sn-Ag-Cu Ball Grid Array (BGA) Components in Sn-Pb Assembly Process

For companies that choose to take the Pb-free exemption under the European Union’s RoHS Directive and continue to manufacture tin-lead (Sn-Pb) electronic products,there is a growing concern abo .. read more

Board Level Interconnect Reliability Assessment of High I/O BGA Packages

To meet the complex design requirements of the electronics industry,there is an increased need for large size high I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+ .. read more