Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more
Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
.. read more
Drop Testing of a Pb-Free Board after Assembly and SnPb-Rework
•Board-level drop shock test was performed on 9 assemblies
–63 parts / board
–Parts representative of military package styles
•Assembled on Pb-free compatible laminate with SAC 305 solder
•Sele
.. read more