Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
.. read more
Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
.. read more
Numerical Study on New Pin Pull Test for Pad Cratering Of PCB
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w
.. read more
Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou
.. read more
Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more
Pad Cratering
Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
A New Approach for Early Detection of PCB Pad Cratering Failures
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. read more
Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
.. read more
Assembly and Reliability Investigation of Package on Package
This paper discusses the results of several independent experiments designed to address the many aspects of successful PoP integration. Assembly through the use of in-line stacking and pre-stac
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. read more
Cold Ball Pull Test Efficiency for the PCB Pad Cratering Validation with the Ultra Low Loss Dielectric Material
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
.. read more
Analysis of Laminate Properties for Correlation to Pad Cratering
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c
.. read more
Numerical Study on New Pin Pull Test for Pad Cratering Of PCB
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w
.. read more
Pad Cratering Susceptibility Testing with Acoustic Emission
Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou
.. read more
Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
.. read more
Reliability Screening of Lower Melting Point Pb-Free Alloys Containing Bi
This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili
.. read more
Methodology to Predict Mechanical Strength and Pad Cratering Failures under BGA Pads on Printed Circuit Boards
In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs).
.. read more
Pad Cratering
Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates
.. read more
The Application of Spherical Bend Testing to Predict Safe Working Manufacturing Process Strains
The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates.
Newly developed laminates have different curing processes,are commonly fil
.. read more
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC)
failures under excessive PCB bending. Pad cratering cracks are not d
.. read more
A New Approach for Early Detection of PCB Pad Cratering Failures
Pad cratering refers to the initiation and propagation of fine cracks beneath BGA pads in organic substrates or printed circuit boards. These cracks,which usually initiate under the application
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. read more
Characterizing the Lead-Free Impact on PCB Pad Craters
Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo
.. read more
Assembly and Reliability Investigation of Package on Package
This paper discusses the results of several independent experiments designed to address the many aspects of successful PoP integration. Assembly through the use of in-line stacking and pre-stac
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. read more