Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more
Coating Thickness Measurement of Thin Gold and Palladium Coatings on Printed Circuit Boards using X-Ray Fluorescence
- DD Detector is State of the Art
- Software: Addressing all measurement challenges; Measurement Results for Au,Pd and Ni(P),independent of substrate material
- Traceability and Reproducibility
.. read more
Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish
We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal
cycle (TC) by varying the thickness of Palladium (Pd) in Electrole
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
What’s Wrong With My Surface Finish? An Evaluation of the Limitations of Common Surface Finishes
This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market
today. The goal is to spark the industry interest,that it may double its efforts
.. read more