Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. read more
Quantifying Parasitic Induced by No-Clean Solder Paste Residue at RF Frequencies
Residue left behind from no-clean assembly is a visually obvious artifact of the manufacturing process that can
cause concern to those with RF circuit assemblies. This paper describes a test ve
.. read more
Via in Pad Study Evaluating the Impact on Circuit Design,Board Layout,Manufacturing,Emissions Compliance and Product Reliability
Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed
circuit board designs as well as the need to minimize parasitic capacitance
.. read more
Quantifying Parasitic Induced by No-Clean Solder Paste Residue at RF Frequencies
Residue left behind from no-clean assembly is a visually obvious artifact of the manufacturing process that can
cause concern to those with RF circuit assemblies. This paper describes a test ve
.. read more