Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. read more
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. read more
Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Profile-Free Copper Foil for High Density Wiring and High Frequency Application
Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data
transmission speed. Therefore,we have developed a new profi
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. read more
New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
.. read more
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. read more
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
Effect of Microwave Plasma Surface Treatement for Improved Adhesion Strength of Direct Copper Plating on Polterafluoroethylene (PTFE)
The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper.
.. read more
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
.. read more
Controlling Moisture During Inner Layer Processing
•Two primary failure modes from trapped moisture:
•Premature resin decomposition from incomplete resin cross-linking.
•Explosive vaporization during high temperature thermal exposure.
.. read more
Newest ED-Copper Foils for Low Loss / High Speed PCBs and for IC-Packaging
The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications.
Copper surface roughness h
.. read more
Impregnation of Metal Complex into Epoxy Insulation Materials Using Supercritical Carbon Dioxide and Its Application for Copper Plating
Metal plating of epoxy polymer has been widely applied for industrial products for a long time,especially in the field of Printed Circuit Boards (PCB’s). This technique is one of the most impor
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
A Non-Vacuum Process for Deposition of Thin Copper on Flexible Base Materials
The use of flexible circuit boards in the design and manufacture of electronic products has experienced a consistent and rapid growth over the last 15 years because their light weight and physi
.. read more
Effect of Plasma Surface Treatment for Peel Strength of Metallization Based on Polyimide
The purpose of this study is to investigate the optimum plasma processing as a pre-treatment for the surface of Polyimide (PI) in order to increase adhesion strength of electroless copper (Cu)
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Lead Free Processing and other Thermal Challenges for Flexible Printed Circuits
In this paper,factors that influence the ability for a flex circuit,especially a multilayer flex circuit,to survive the lead-free soldering and other thermal processes during the circuit fabric
.. read more
Profile-Free Copper Foil for High Density Wiring and High Frequency Application
Nowadays,the growth of electronic industry is remarkable. All electronic devices are getting smaller with higher performance and data
transmission speed. Therefore,we have developed a new profi
.. read more
Thermally Conductive Free-Standing Dielectric Materials for Printed Circuit Boards without Halogens or Phosphorous
At the same time the electronics industry is moving towards higher power and faster clock speed,components are becoming
smaller in size and packed more densely on circuit boards. Together these
.. read more
New Lead Free Solder Composition and Physical Properties of Printed Wiring Board Laminate Material To Suppress Lift-Off and Improve Reliability
Lift-off (fillet-lifting) and land-lifting phenomena,which occur in wave soldering with Sn-Ag-Cu (SAC) solders,depend
on the physical properties of the solder and the laminate material used. A
.. read more
New Circuit Formation Technology for High Density PWB
To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed.
Especially important are technologies of circuit formation for high-end P
.. read more
Novel Polyimide Build-up Material for Fine-line Fabrication
We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount
high speed CPUs with high I/O numbers. These PWBs meet the following require
.. read more
Insulation Material for Next Generation Packaging Substrates
With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor
devices are required to cope with finer patterning and higher wiring densi
.. read more
A Comparison of PCB Adhesion Test Methods and Adhesion Promoters
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the
advent of lead free soldering processes that severely stress the mechan
.. read more
Adhesiveless Copper on Polyimide Substrate with Nickel-Chromium Tiecoat
Adhesiveless copper on polyimide substrates are used extensively for high density,flexible circuit applications. A
typical construction includes the polyimide substrate,a thin vacuum deposited
.. read more