Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. read more
Factors Affecting the Adhesion of Thin Film Copper on Polyimide
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very
.. read more
An Analytical Characterization and Comparison of Adhesion Test for PCBs
Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes which severely stress the mecha
.. read more
Pad Cratering Evaluation of PCB
Pad cratering in the PCB is a new failure mode encountered in electronic assemblies,particularly in lead-free products. The
failure mechanisms and root causes are not yet fully understood,and l
.. read more
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. read more