Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more