Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
Applications of Solder Fortification with Preforms
Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
.. read more
Assembly Reliability of TSOP/DFN PoP Stack Package
Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package-
.. read more
Applications of Solder Fortification with Preforms
Although many have predicted the demise of through-hole components,they are alive and well with tens of billions assembled each year. In many cases these components are assembled by wave solder
.. read more
Investigation for Use of ‘Pin in Paste’ Reflow Process with Combination of Solder Preforms to Eliminate Wave Soldering
The Pin in Paste (PiP) technology is the process of soldering Pin through hole (PTH) components using the Surface Mount Technology (SMT) reflow process. The use of PiP process offers several ad
.. read more
Through-Hole Assembly Options for Mixed Technology Boards
Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower
ultimate cost of SMT makes it a preferred assembly technology. However,the
.. read more