Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. read more
Imprinted Interconnects Technology (I2T),a Revolutionary Method for the Production of Very-High-Density Interconnects (VHDI)
Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more
importantly,to decrease manufacturing costs. The current technological approach d
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
Via Hole Filling Technology for High Density,High Aspect Ratio Printed Wiring Boards Using a High Tg,low CTE Plugging Paste
The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and
.. read more
Filling Pastes in PCB Production – Fields of Application,Possibilities and Limitations
In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids
content of 100% are still successfully employed today to close via
.. read more
Imprinted Interconnects Technology (I2T),a Revolutionary Method for the Production of Very-High-Density Interconnects (VHDI)
Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more
importantly,to decrease manufacturing costs. The current technological approach d
.. read more