Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. read more
High Temperature Reliability of Components for Power Computing with SAC305 and Alternative High Reliability Solders with Isothermal Aging at 25...
This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin
.. read more