Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. read more
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. read more