Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications

There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR) plating to electroplate printed circuit boards. PPR plating offers .. read more

Electroplating and Properties of Lead-Free Finishes

Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating of these alloys is challenging because of great difference in reduction pote .. read more

The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards

Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes .. read more

Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications

There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR) plating to electroplate printed circuit boards. PPR plating offers .. read more

Electroplating and Properties of Lead-Free Finishes

Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating of these alloys is challenging because of great difference in reduction pote .. read more

The Use of Insoluble,Mixed Metal Oxide Coated Titanium Anodes to Improve Quality and Decrease Plating Times for Circuit Boards

Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes .. read more