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Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more
Improvement of Via Connection Reliability by Thinning Electroless Copper Plating
In the latest IC substrate PCBs, via holes have downsized and these diameters have minimized below 10μm, which have led to the issues of connection reliability. In a conventional process, ad
.. read more
Characterization of Acid Copper Plating Solution for Via-Filling
The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with
high-density interconnections. However,in the case of copper film deposited
.. read more