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New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
.. read more
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. read more
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. read more
Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
.. read more
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. read more
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. read more
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Detect PCB Stack-up Error with Machine Learning Methods
In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. Most o
.. read more
PTH Core-to-Core Interconnect Using Sintered Conductive Pastes
The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and
focused on specialized applications in the military and high end comp
.. read more
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. read more
Development of the High Thermal Conduction Laminates for Large Current Board
With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring
boards for automotive and industrial applications,we identified the opti
.. read more
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. read more
Comparison of High-Tg-FR-4 Base Materials
Customer demands concerning thermal stability of PCB base materials are increasing. Rising complexity of
printed circuit boards requires an improved quality of the dielectric in terms of cleanl
.. read more
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev
.. read more