Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. read more
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. read more
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
This work explores radio frequency (RF) reflectometry as an early-stage defect detection technology for electronics. In-circuit testing (ICT) is limited to fully assembled boards, while auto
.. read more
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
A study of methods for improving direct imaging registration for Ultra High Density Interconnect [UHDI], flex and other challenging constructs using new and existing registration technologie
.. read more
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. read more
Design Considerations for Sustainable Printed Circuit Boards
In addition to manufacturability, performance, reliability and cost, environmental impact increasingly becomes a design driver for printed circuit boards and assemblies. A prerequisite is th
.. read more
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. read more
A Novel Fully Recyclable and Biodegradable PCB Material with a Drastically Reduced Carbon Footprint for Single Use and Short Lifetime...
The paper presents the development of an innovative recyclable and biodegradable PCB substrate material created to meet the stringent environmental demands of future electronic products. The
.. read more
iNEMI Reliability and Loss Properties of Copper Foils for 5G Applications
The advancement of high-frequency applications, especially for 5G technology, demands PCBs endure thermal shock during soldering while preserving signal integrity. Traditional copper foil su
.. read more
Early Defect Detection with a Scalable Broad-Spectrum Test Using Radiofrequency Reflectometry
This work explores radio frequency (RF) reflectometry as an early-stage defect detection technology for electronics. In-circuit testing (ICT) is limited to fully assembled boards, while auto
.. read more
Tooling Population Effects on Imaging Registration Accuracy for UHDI Substrates
A study of methods for improving direct imaging registration for Ultra High Density Interconnect [UHDI], flex and other challenging constructs using new and existing registration technologie
.. read more
Printed Circuit Board Challenges for Achieving Signal Integrity at 224Gb/s and Beyond
The datacenter continues to demand increasingly higher component data rates to satisfy growing application requirements. Efforts are underway, as illustrated by the IEEE 802.3dj objectives[1
.. read more
Design Considerations for Sustainable Printed Circuit Boards
In addition to manufacturability, performance, reliability and cost, environmental impact increasingly becomes a design driver for printed circuit boards and assemblies. A prerequisite is th
.. read more
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. read more