Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Revolutionary Printing Solution for Heterogeneous Surface Mount Assembly
As consumers the expectation of increased functionality within new products is a given. However there comes a time where this tireless demand for product efficiency starts to stretch the design
.. read more
Effect of Nano-Coated Stencil on 01005 Printing
The demand for product miniaturization,especially in the handheld device area,continues to challenge the board assembly industry. The desire to incorporate more functionality while making the p
.. read more
Photochemical Machining (PCM) for Cost-effective,Rapid Production
Photochemical machining (PCM) is an excellent method for manufacturing both simple and complex parts in a wide range of
engineering materials. In the harsh economic climate facing manufacturing
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
Drilling of Printed Circuit Boards: An Innovative,Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills
The interaction of the drill entry material and the drill tool are critical to producing accurately aligned connections between the different layers in a printed circuit board. The trend toward
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances
Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
.. read more
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. read more
Process Capability Studies – The Better Way
To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability
indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve
.. read more
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. read more
A Revolutionary Printing Solution for Heterogeneous Surface Mount Assembly
As consumers the expectation of increased functionality within new products is a given. However there comes a time where this tireless demand for product efficiency starts to stretch the design
.. read more
Effect of Nano-Coated Stencil on 01005 Printing
The demand for product miniaturization,especially in the handheld device area,continues to challenge the board assembly industry. The desire to incorporate more functionality while making the p
.. read more
Photochemical Machining (PCM) for Cost-effective,Rapid Production
Photochemical machining (PCM) is an excellent method for manufacturing both simple and complex parts in a wide range of
engineering materials. In the harsh economic climate facing manufacturing
.. read more
Next Generation Pattern Electroplating Process for Microvia Filling and Through Hole Plating
The use of electrodeposited copper for filling blind microvias has grown rapidly to become an essential and widely adopted
process used by various Printed Circuit Board (PCB) and package substr
.. read more
Drilling of Printed Circuit Boards: An Innovative,Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills
The interaction of the drill entry material and the drill tool are critical to producing accurately aligned connections between the different layers in a printed circuit board. The trend toward
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
Understanding the Requirements of a Mass-Imaging Platform with Reference to the Impact of Interconnect Miniaturisation
As the frontiers of feature size and interspace between devices become ever challenging,we as an industry have to start revaluating the performance of the toolsets that are used in the SMT aren
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Broadband Printing – A Paradigm
The SMT industry is going through a challenging phase of assembling miniature components,such as micro BGA,0.3mm CSP and 01005 passives onto Printed Circuit Boards (PCB). This effort is primari
.. read more
Low-Silver BGA Assembly Phase I – Reflow Considerations and Joint Homogeneity Initial Report
Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in
.. read more
X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances
Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni
.. read more
Using Periodic Pulse Reverse (PPR) for Plating Thick Panel Applications
There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR)
plating to electroplate printed circuit boards. PPR plating offers
.. read more
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
.. read more
Squeegee Blades vs. Pump Technology: A Comparison of Solder Paste Print Performance
Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional
squeegee printing. By design,enclosed print heads offer several advan
.. read more
Process Capability Studies – The Better Way
To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability
indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve
.. read more
Benchmarking PCB Process Capability,Quality and Reliability Becomes a Reality
The IPC-PCQR2 (Process Capability,Quality and Relative Reliability) program has developed a library of process
capability panel designs,and a database that details the manufacturing capability,
.. read more