Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t
.. read more
Concentration Monitoring & Closed Loop Control – Phase 2
Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I
.. read more
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. read more
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. read more
Flip Chip Package Qualification of RF-IC Packages
Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. read more
Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Closed Loop Printer Control
Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs
.. read more
The Landscape of PCB Technology is changing rapidly. How Will AOI Testing Keep Up?
Ideas,manufacturing processes,materials and components that were in the realm of science fiction a few years ago are now being adopted into mainstream PCB products. Devices are getting smaller,
.. read more
Standardized Traceability Ratings for Manufacturing
Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a
.. read more
A New AOI Programming and Inspection Paradigm Based On Recent Studies in Neuroscience Reduces the Need for Human Intervention and...
The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. read more
Closed-Loop Process Control in the Solder Paste Printing Process
Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to
inspect printed solder paste deposits immediately after the printin
.. read more
Solder Paste Printing Inspection – An Inside Look
Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste
printing. Here is an inside look at the factors potential purchasers of t
.. read more
Comparative Evaluation of AOI Systems
The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing
for process control and product verification. Defects must be caught ear
.. read more
Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
.. read more
Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment
In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce
.. read more
A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t
.. read more
Concentration Monitoring & Closed Loop Control – Phase 2
Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I
.. read more
Enclosed Media Printing as an Alternative to Metal Blades
Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the
.. read more
Rework Challenges for Smart Phones and Tablets
Smart phones are complex,costly devices and therefore need to be reworked correctly the first time.
In order to meet the ever-growing demand for performance,the complexity of mobile devices has
.. read more
Flip Chip Package Qualification of RF-IC Packages
Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac
.. read more
Pad Design and Process for Voiding Control at QFN Assembly
Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry recently. This package offers a number of benefits including (1) small size,such as a near die si
.. read more
OA Flux Cleaning Studies on Highly Dense Advanced Packages Parameters
Cleaning flux residues post soldering has been a high reliability criterion practiced by assemblers of military,aerospace,automotive,medical devices and other value offerings. Highly dense adva
.. read more
Advances in Automatic Monitoring of Stencil Printing Processes
The electronics assembly industry has long wished for and made great advancements toward developing a true,closed-loop automatic print verification and process monitoring technology. While sign
.. read more
Telecommunications Case Studies Address Head-In-Pillow (Hnp) Defects and Mitigation through Assembly Process Modifications and Control
One of the most perplexing phenomena in the electronic manufacturing industry today is the defect called “head-in-pillow.”
Head-in-Pillow (HnP) defects occur on the blind solder joints of area
.. read more
Closed Loop Printer Control
Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs
.. read more
The Landscape of PCB Technology is changing rapidly. How Will AOI Testing Keep Up?
Ideas,manufacturing processes,materials and components that were in the realm of science fiction a few years ago are now being adopted into mainstream PCB products. Devices are getting smaller,
.. read more
Standardized Traceability Ratings for Manufacturing
Traceability and process control are no longer requirements reserved for manufacturers in regulatory or specific market segments. Today,all manufacturers who aspire to achieve or to maintain a
.. read more
A New AOI Programming and Inspection Paradigm Based On Recent Studies in Neuroscience Reduces the Need for Human Intervention and...
The hidden cost of optical inspection systems is often in the programming time. In this paper we discuss a new AOI programming and inspection paradigm reduces the need for human intervention an
.. read more
Improving SMT Yield with AOI and AXI Test Results Analysis
As printed circuit board assembly (PCBA) becomes more complex,Automatic Optical Inspection (AOI) and Automatic Xray Inspection (AXI) systems are becoming more widely used in electronics manufac
.. read more
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. read more
Closed-Loop Process Control in the Solder Paste Printing Process
Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to
inspect printed solder paste deposits immediately after the printin
.. read more
Solder Paste Printing Inspection – An Inside Look
Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste
printing. Here is an inside look at the factors potential purchasers of t
.. read more
Comparative Evaluation of AOI Systems
The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing
for process control and product verification. Defects must be caught ear
.. read more
Cost-Effective Placement Machine Capability Analysis and Process Control
New component packaging formats create the need for greater production process stability,reproducibility and
precision. This leads to a growing demand for process control solutions.
As manufact
.. read more
Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment
In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce
.. read more