Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Analysis on Combination of AOI and AVI machines
In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m
.. read more
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. read more
Effective Transition of Electronics Production between Manufacturing Sites
“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the
automotive electronics industry. The result has been numerous plant closings an
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Design of Flexible RFID Tag and Rectifier Circuit using Low Cost Screen Printing Process
Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more
Analysis on Combination of AOI and AVI machines
In PCB industry,AOI (Automated Optical Inspection) has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI m
.. read more
WLCSP and Flip Chip Production Bumping using Electroless Ni/Au Plating and Wafer Level Solder Sphere Transfer Technologies
There are three main packaging technologies used by the semiconductor industry today to create solder bumps on wafers: paste printing,electroplating,or sphere dropping [1]. The choice between t
.. read more
Effective Transition of Electronics Production between Manufacturing Sites
“Unprecedented” is a word often used to describe the events caused by the economic downturn and its impact on the
automotive electronics industry. The result has been numerous plant closings an
.. read more
Lead Free Process Development with Thick Multilayer PCBA Density in Server Applications
Although the EU RoHS legislation restricts the use of lead in electronics equipment,many high-end multi layer server printed circuit board assemblies (PCBAs) continue to be built with lead unde
.. read more
Design of Flexible RFID Tag and Rectifier Circuit using Low Cost Screen Printing Process
Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF
.. read more
Qualification of PWBs Outsourced from Asia
The growth of portable wireless products and related consumer electronics is fueling a major outsourcing effort towards Asia. Most OEM (original equipment manufacturers) are partnering with CMs
.. read more
C4NP Lead Free vs. Electroplated High Lead Solder Bumps
There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These
include electroplating,solder paste printing,evaporation and the direct a
.. read more
Lead-Free Solder Flip Chips on FR-4 Substrates with Different Assembly Processes and Materials
This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200-
250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac
.. read more