Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Component Misplacement Prevention on the ICOS Tape & Reel process using TRIZ & Lean
The paper discusses on the problems faced by the Assembly,Test Manufacturing (ATM) plants of Intel Corporation for a certain Tape and Reel Process. The problem is generic across the other siste
.. read more
Dynamic LEAN Shop Floor SMT Material Control Starting ONLY What You Can Finish
In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf
.. read more
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture
.. read more
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. read more
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. read more
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Component Misplacement Prevention on the ICOS Tape & Reel process using TRIZ & Lean
The paper discusses on the problems faced by the Assembly,Test Manufacturing (ATM) plants of Intel Corporation for a certain Tape and Reel Process. The problem is generic across the other siste
.. read more
Dynamic LEAN Shop Floor SMT Material Control Starting ONLY What You Can Finish
In high mix (250+ Assemblies) environments,ensuring small batches are delivered in a timely yet flexible manner without large levels of safety stock and WIP requires the very best of LEAN Manuf
.. read more
Economic and Technical Advantages of Chemical Dross Elimination and Prevention
Dross generation has always been a costly issue for the electronics assembly industry. At least half,and in many cases,more than half of the metal (solder) purchased for electronic manufacture
.. read more
Selective Electroless Nickel and Gold Plating of Individual Integrated Circuits for Thermocompression Gold Stud Bump Flip-Chip Attachment
Flip chip bonding is the most desirable direct chip attachment approach for minimizing electronic assembly size as well as
improving device performance. For most prototyping applications it is
.. read more
The Graping Phenomenon: Improving Pb-Free Solder Coalescence through Process and Material Optimization
As small surface-mount components such as 0201 and 01005 packages have entered volume assembly,manufacturers are observing increased instances of poor solder coalescence during reflow. The root
.. read more
Increasing Profitability through Process Optimization: Better Than Outsourcing
Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more