Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. read more
Impact of Hole-Fill and Voiding on Pin Through-Hole Solder Joint Reliability
In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m
.. read more
Optimised Vertical Process for Microvia Filling and Through Hole Metallization Under Production-like Conditions
This article summarises how a copper metallization process for simultaneous via filling and through hole plating was
developed on a laboratory scale and the challenges encountered by scale-up t
.. read more