Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board
Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa
.. read more
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. read more
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more
Derivation of Equation on Thermal Life Prediction of Plated Through Hole for Printed Wiring Board
Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa
.. read more
Building Reliability into the PWB: Optimization of the Desmear and Metalization Processes for Use on High Frequency and Lead Free...
High Frequency and Lead-Free laminate materials are finding increased use in the PWB fabrication industry driven by end
user requirements for high-speed signal transmission and lead-free solder
.. read more
Predicting Plated Through Hole Life at Assembly and in the Field from Thermal Stress Data
Over the past ten years,two new test methods: Interconnect Stress Test [1] and Highly Accelerated Thermal Shock [2] have
been developed to perform thermal cycling testing and in particular,to m
.. read more
Experimental and Numerical Assessment of Plated Via Reliability
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more