Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more
An Investigation into Low Temperature Tin-Bismuth and Tin-Bismuth-Silver Lead-Free Alloy Solder Pastes for Electronics Manufacturing Applications
The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component
.. read more
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd- Layers
As a surface finish,electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention
for both packaging/IC-substrate and PWB applications. With a lower gold
.. read more
Soldering Process Improvement of Critical SMT Connectors and for the Retention of Press-fit SFP Cages
As Original Design Manufacturers (ODM) adopt the use of finer pitch connectors,with increased pin count on PCB assemblies. It becomes challenging for Electronic Contract Manufacturing Services
.. read more
Visual and Reliability Testing Results of Circuit Boards Assembled with Lead Free Components,Soldering Materials and Processes in a Simulated Production...
The New England Lead-free Electronics Consortium is a collaborative effort of New England companies spanning the
electronics supply chain,sponsored by the Toxics Use Reduction Institute,the U.S
.. read more