Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
.. read more
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. read more
Blind Micro Via and Through Hole Filling in Horizontal Conveyorised Production System
This paper presents a novel electrolytic copper panel plate system incorporating equipment and specially developed electrolyte which enables filling of blind micro vias with a minimum of surfac
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
Uniformity of Nickel Plating Thickness in High Aspect Ratio Plated Through Holes
Nickel plating is often used on PWBs to increase wear resistance and to prevent diffusion between copper and other plated metals. The nickel plating is often present in through holes as well as
.. read more
The Effect of Plating Cell Configuration on the Quality of Copper Deposit for Printed Circuit Boards
This paper addresses the effect of pulse plating of electronic interconnects for advanced electronic modules. This paper
builds on earlier work by correlating plating cell and tank design issue
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
Cost Effects of Pulse Plating Reversal Current
Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its
.. read more
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. read more