Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
.. read more
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically medi
.. read more
Use of Modulated Current Technology for High Performance Pulse Reverse Plating
Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of
.. read more
Programming Considerations in Complex Wave Form Pulse Reverse Plating: Part 1,Developing the Tool
With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the u
.. read more