Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more